UK chipmaker EnSilica has embarked on a strategic partnership with Taiwan’s leading semiconductor company.
- The collaboration aims to boost the development of advanced AI and mobile applications through improved silicon success.
- EnSilica joins the TSMC Design Center Alliance to enhance its system-on-chip designs.
- This alliance is part of EnSilica’s strategic expansion after securing a key contract with Siemens AG.
- EnSilica’s financials show increased revenues despite slight pre-tax losses.
UK chipmaker EnSilica has made a significant move by entering into a strategic partnership with Taiwan’s largest semiconductor enterprise. This collaboration is expected to accelerate the development of advanced technology, particularly in the realms of AI and mobile applications. By joining forces, both companies aim to leverage their respective strengths to improve first-time silicon success and lower design barriers for semiconductor innovators.
The collaboration involves EnSilica becoming a part of the Design Center Alliance within the Open Innovation Platform of Taiwan Semiconductor Manufacturing Company (TSMC). This initiative is intended to facilitate innovation by enabling faster implementation and enhancing the performance and efficiency of next-generation AI and mobile chips. Through this alliance, EnSilica aims to strengthen its offerings in system-on-chip designs, encompassing applications from mixed signal devices to edge AI chips, using TSMC’s cutting-edge process technologies.
Ian Lankshear, CEO of EnSilica, expressed that joining TSMC’s DCA programme is a notable milestone for the organisation. According to Lankshear, their deep expertise in mixed signal and RF design, coupled with TSMC’s advanced technology, will allow EnSilica to deliver unmatched solutions to their mutual customers. This statement highlights the importance of this partnership in advancing technology solutions.
Dan Kochpatcharin, responsible for Ecosystem and Alliance Management at TSMC, emphasised their commitment to collaborating with ecosystem partners like EnSilica. The focus is on empowering customers to achieve their design objectives swiftly and bring their innovative ideas to market more efficiently. This partnership aligns with TSMC’s strategic objectives of enhancing customer success and innovation.
This partnership is part of EnSilica’s broader expansion strategy, evidenced by its recent contract with Siemens AG for ASIC design and supply. The company has also reported the shipment of five million ASIC units for the automotive industry, showing progress in its operational capabilities. Financially, EnSilica reported half-year revenues of £9.6 million, marking an 11.5% increase from the previous year, although pre-tax losses slightly expanded to £309,000.
The collaboration between EnSilica and Taiwan’s leading semiconductor firm marks a pivotal step in advancing next-generation semiconductor innovations.
